Electrosurgical electrode and method of manufacturing same

ABSTRACT

An electrosurgical device coated with powder coatings including a silicone resin and siloxane additive without fluoropolymers. In the powder coatings, the silicone resin is methyl phenyl silicone or phenyl silicone or methyl polysiloxane or phenyl alkyl polysiloxane resin and the additive is either methyl alkyl polysiloxane or dimethyl polysiloxane. This coating is applied to the surfaces of an electrosurgical device minimize the build-up of charred tissue on the surfaces of the electrosurgical device.

PRIORITY CLAIM

This application is a divisional of and claims the benefit of U.S.patent application Ser. No. 11/127,545, filed May 12, 2005, the entirecontents are incorporated herein.

CROSS REFERENCE TO RELATED APPLICATIONS

This application relates to the following co-pending commonly ownedpatent applications: “COATING REINFORCING UNDERLAYMENT AND METHOD OFMANUFACTURING SAME,” Ser. No. 10/318,503, Attorney Docket No.6491800-111, now abandoned; “ANTI-MICROBIAL ELECTROSURGICAL ELECTRODEAND METHOD OF MANUFACTURING SAME,” Ser. No. 10/649,199, Attorney DocketNo. 6491800-114; “PERFLUOROALKOXY COPOLYMER COATED GLASS AND METHOD OFMANUFACTURING,” Ser. No. 11/090,615, Attorney Docket No. 6491800-125,now abandoned; “TETRAFLUORETHYLENE PERFLUOROMETHYL VINYL ETHER COPOLYMERCOATED GLASS AND METHOD OF MANUFACTURING SAME,” Ser. No. 11/107,234,Attorney Docket No. 6491800-121

BACKGROUND

Electrosurgery refers to surgical procedures that pass high frequency,alternating electrical current through body tissues to cut or coagulatethe tissues. Electrosurgical instruments or tools such aselectrosurgical electrodes are used in these surgical operations to cut,coagulate and cauterize the tissue of a patient. The electrodes conductthe high frequency alternating electrical current from a generator tothe patient to perform these operations. The generator is the source ofthe electricity for the surgical procedure. Because standard electricalcurrent alternates at a frequency of sixty cycles per second (60 Hz),which could cause excessive neuromuscular stimulation and possiblyelectrocution if used, the generator takes sixty cycle current andincreases the frequency to over 300,000 cycles per second (300,000 Hz).At this frequency, the electrical energy can pass through the patientwith minimal neuromuscular stimulation and no risk of electrocution.Additionally, the generators are able to produce a variety of electricalwaveforms. A constant waveform, which produces heat very rapidly, isgenerally used to vaporize or cut body tissue. An intermittent waveformproduces less heat and is generally used to coagulate body tissue.Several different waveforms may used in an electrosurgical procedure toachieve different effects.

As described above, electrosurgical electrodes are used to cut orcoagulate the body tissue in an electrosurgical procedure. Many sizesand shapes of electrosurgical electrodes such as blades, scalpels,needles, wire forms, balls and probes are available. Mostelectrosurgical electrodes are made of metal, typically stainless steel.Generally, a portion of the electrode is sheathed or encapsulated withan insulative material such as a plastic material. The electrodes aretypically inserted into and connected to a handpiece for manipulatingthe electrode during surgery.

The working surface of the electrosurgical electrode or the exposed endof the electrode is not encapsulated with plastic or any type ofelectrically insulative material. The working surface generates heat andtherefore is subject to high temperatures during use. The hightemperature causes the body tissues to tend to stick to the workingsurface of the electrode. Specifically, the elevated temperature of theelectrode causes charred tissue, commonly called “eschar,” to adhere orstick to the working surface of the electrode. The buildup of tissue oreschar on the working surface of the electrode negatively affects theperformance of the electrode during surgery. In particular, a buildup oftissue on the electrode reduces the transfer of energy to and from theelectrode which decreases the cutting effectiveness of the electrode.Additionally, the tissue buildup may obscure the vision of the surgeonand therefore make it more difficult to perform the surgery.

As a result, efforts are made during surgery to keep the working surfaceof the electrode clean. Such cleaning methods include rubbing, brushingor scraping the electrode surface against a scouring pad or othersuitable cleaning device. The continuous cleaning of the surface of theelectrode, however, prolongs the surgical procedure which is notdesirable. Therefore, the surgeon is left with the options of replacingthe electrode during surgery, accepting reduced performance of theelectrode, or expending valuable time and energy in an attempt tothoroughly clean the surface of the electrode with an abrasive pad. Ifthe surgeon must clean the surface of the electrode with an abrasivepad, as while scouring the coated surface of the blade, the surgeon mustspend additional time and attention to not damage or wear through theprotective coating.

One method used to solve the problem of tissue or eschar buildup on thesurface of the electrode is to coat the surface of the electrode with anon-stick or surface release coating. The non-stick or release coatingminimizes the sticking or adherence of the tissue on the surface of theelectrode and enables the built up tissue to be removed more easily andefficiently from the surface.

Several different types of non-stick coatings have been used orsuggested for application to electrosurgical electrodes. Some of thedifferent non-stick coatings or materials include fluorinatedhydrocarbon materials, polytetrafluoroethylene, perfluoro-alkoxy,flexible silicone elastomers, ceramic composites, paralyene silanepolymers and other suitable non-stick coatings. Different methods existfor applying the non-stick coating to the surface of the electrosurgicalelectrodes. However, the non-stick or release coatings have varyingdegrees of electrically insulative qualities, and therefore, may changeand/or impair the electrical conductivity of the surface of theelectrodes. Some of such coatings are thinner (due to their inherenttechnical limitations and/or cost of production reasons) and thus possesless than optimum electrical and/or insulative properties. Othercoatings provide discontinuous protection of the underlying metal bladeand may contain micro fractures, holes and/or “holidays.” It should beappreciated that coating areas of reduced thickness and areas whereinthe coating is missing may alter the electrical insulative or surfacecharacteristics of the electrical energy emitted from the surface of thecoating, thus affecting the quality and consistency of the use of theblade. Such altered electrical insulative properties present an erraticand potential inconsistent function of the use of the electrosurgicaldevice as a surgical tool.

Moreover, certain of these non-stick coatings, particularly thefluoropolymers, may break down and emit harmful byproducts as the coatedportion or portions of the electrosurgical electrode are heated totemperatures above 500° F. (260° C.). In addition to breaking down attemperatures above 500° F. (260° C.), as certain of these non-stickcoatings approach 500° F. (260° C.), micro-fractures or fissures in thecoating surface take place. These micro-fractures provide additionalareas for eschar or carbonized organic matter to adhere to theelectrosurgical device. As the coating breaks down due to thermaloverheating of specific areas of the blade, particularly the edges andtip of the blade, the electrical insulative quality of the originalcoating is diminished and eventually destroyed. Accordingly, the userwill need to change the electrical settings of the electrical generatoror need to change to a new blade to achieve consistent end use results.

Another issue associated with surgical instruments such aselectrosurgical electrodes is the cleanliness of the working surface andother surfaces of the electrode as the electrode contacts tissue andother parts of the body. The tissue or eschar buildup on the workingsurface of the electrode creates an environment where bacteria and otherharmful organisms may cultivate and be introduced into the body duringthe surgical process. Furthermore, any gaps between the plastic sheathand the electrode or any fractures, fissures or other defects in theplastic sheath enables bacteria and other organisms to get underneaththe plastic sheath and also into and grow in the fractures, fissures anddefects or other interstices in the plastic sheath. This warmenvironment also promotes organism and bacteria growth. This furtherpromotes the growth of the bacteria and the harmful organisms which maymigrate to the surface of the electrode or to the patient. Bacteriaforming on the eschar which in turn enters a patient's body during asurgical procedure can cause significant difficulties and complicationsfor the patient after the surgical procedure is complete. As a result,minimizing the buildup of tissue or eschar and thus minimizing thegrowth of bacteria and other organisms on the electrode surface (andbetween the insulating sheath and the electrode shaft) is desirable toenable the electrode to be used multiple times to minimize and/orprevent infections or other related complications from developing in apatient following surgery.

Accordingly, there is a need for an improved electrosurgical device suchas a single use or multi-use electrosurgical electrode and method ofmanufacturing same which minimizes the buildup of tissue on thesubstrate or working surface of the electrode during storage, use orpauses in the use of the electrode. Additionally, there is a need for animproved electrosurgical device which has superior easy-to-cleancharacteristics if the user desires to or must clean the electrosurgicaldevice for multiple uses and/or store the previously used blades forfuture uses.

SUMMARY

The present disclosure relates in general to an electrosurgicalelectrode, and, specifically to an electrosurgical electrode coated witha specifically formulated epoxy modified rigid silicone powder non-stickcoating and a method of manufacturing the same.

In one embodiment, an epoxy modified rigid silicone powder non-stickcoating is applied to an electrosurgical device such as anelectrosurgical blade, knife, wire, ball or other shape. In oneembodiment, the electrosurgical device includes an electrode including aconductive substrate or conductive material where at least a portion ofthe electrode is encapsulated in a substantially electrically insulativematerial such as plastic, a handle connected to one end of the electrodeand electrical conductors which are attached inside the handle toconduct electricity from an electrical source and deliver or transferthe electricity to the electrode. In one embodiment, the electrodeconducts electricity to generate heat and cut, coagulate and/orcauterize tissue during a surgical procedure.

In one embodiment, the epoxy modified rigid silicone powder coating isapplied uniformly and evenly to the surface or surfaces of the electrodeto completely coat the exposed distal end or portion and a portion ofthe plastic encapsulated portion of the electrosurgical device. Theepoxy modified rigid silicone powder has both high temperaturecapabilities and non-stick properties. The high temperature resistanceof the epoxy modified rigid silicone powder enables the electrosurgicalelectrode to be heated to temperatures above which other non-stickcoatings may break down and emit harmful byproducts. Accordingly, aftermultiple uses, the epoxy modified rigid silicone powder coating retainsits hardness, surface toughness and non-stick properties on theelectrode and the buildup of tissue or eschar on the working surface ofthe electrode is reduced or prevented.

In one embodiment, the electrosurgical device is coated with a siliconepowder coating that is modified with an epoxy, which when applied to theelectrosurgical device, forms a rigid or relatively hard siliconenon-stick coating. In one embodiment, the epoxy modified rigid siliconepowder coating includes a solid silicone resin and a polysiloxaneadditive. The silicone resin may be selected from the group including aphenyl polysiloxane powder resin, a methyl polysiloxane powder resin, amethyl phenyl siloxane powder resin, a phenyl silicone powder, a methylphenyl silicone and a phenyl alkyl polysiloxane powder resin. Thesiloxane additive may be selected from the group including a methylalkyl polysiloxane, a dimethyl polysiloxane and a methyl phenylsiloxane. It should be appreciated that any suitable epoxy or organicresin base combined with a suitable silicone powder with hightemperature capabilities and non-stick properties (and possibly furthermodified with suitable organic materials and resins) may be implementedto advance or improve the end use high temperature and non-stickproperties of the disclosed powder coating technology.

In one embodiment, the epoxy modified rigid silicone powder particles inthe coating enable the electrosurgical device to reach a desiredtemperature quicker than conventional electrosurgical devices becausethe formulation of the rigid epoxy/silicone powder coating can beformulated with special pigments and additives to increase the thermalconductivity of the coated electrode surface compared to conventionalPTFE or elastomeric silicone coated electrode surfaces. As a result,electricity or heat is more effectively controlled and efficientlyconducted or transferred to the electrode surface. Moreover, compared toelastomeric silicone coatings, in one embodiment, the epoxy modifiedrigid silicone powder may be ground to a finer mesh size for purposes ofapplying a thinner coating, thereby improving the thermal conductivityand coating flexibility without resulting in pinholes or fissures in thecoating. In another embodiment, a thicker coating of the epoxy modifiedrigid silicone powder is applied to the electrosurgical device.Depending on the specific end use characteristics desired, such athicker coating may be achieved by either formulating and manufacturingdifferent particle sizes of the powder coating or through suitablecoating application techniques.

In one aspect of this embodiment, the amount and density of the epoxymodified rigid silicone powder particles (and additives, if any, used ina particular formulation) applied to the surfaces of the electrode isincreased or decreased based on the desired electrical and heatconductivity of the electrosurgical device. The electrical and thermalconductivity can be altered when more epoxy modified rigid siliconepowder particles are included in the coating, when less epoxy modifiedrigid silicone powder particles are included in the coating or whenspecial pigments or additives are used to enhance one or more specificcharacteristics to further optimize the desired end use of the device.Additionally, the density and particle size of the epoxy modified rigidsilicone powder particles applied to the surface of the electrode may beadjusted to increase or decrease the electrical conductivity. When theelectrical conductivity of the electrode is increased, the temperatureof the surface of the electrode is changed. This enables the coatingmixture to be adjusted to optimize the desired end use of the device.

It should be appreciated that one or more combinations of differentshaped epoxy modified rigid silicone powder particles may be used on theworking surface of the electrosurgical electrode. Additionally, thedensity or thickness ranges of the epoxy modified rigid silicone powderparticles may vary depending on the design specifications of an endproduct or final product. The density or distribution of the epoxymodified rigid silicone powder particles may vary from covering oradhering to approximately ten percent of the surface of theelectrosurgical electrode to approximately sixty percent or more of thesurface. Similarly, the density of the epoxy modified rigid siliconepowder particles may vary depending on the end use criteria.

In another embodiment, one or more additional epoxy modified rigidsilicone powder layers are applied to the first or primary epoxymodified rigid silicone powder layer applied to the surface of theelectrosurgical device to meet specific design specifications or coatingrequirements of a manufacturer. The additional bonding material layersmay be the same or different than the first epoxy modified rigidsilicone powder layer and are applied to the first rigid silicone powderlayer until a predetermined thickness is achieved. Additionally,different materials may be added to the bonding material layer orlayers, based on specific design specifications. In another embodiment,different liquid bonding agents may be introduced to the top of thefirst layer of the epoxy modified rigid silicone powder before a secondlayer of the epoxy modified rigid silicone powder is attached to thefirst layer. This process may be repeated to build thicker layers ofepoxy modified rigid silicone powder on all or a selective or individualportion of an electrosurgical device.

In one embodiment, prior to applying the epoxy modified rigid siliconepowder to one or more surfaces of the electrosurgical device, theelectrosurgical electrode is positioned on a support. Initially, thesurface of the electrosurgical electrode is cleaned with a cleaner toremove impurities which may be present on the surface of theelectrosurgical electrode. The cleaner such as a solvent may be manuallyapplied or mechanically applied to the electrosurgical electrode. In oneembodiment, grit blasting or sandblasting is used to clean the surfaceof the electrosurgical electrode. Alternatively, the electrosurgicalelectrode may be pre-cleaned or the method may be performed in a “cleanroom” where the cleaned part is manufactured and the step is notnecessary. In another embodiment, the electrode is heated to atemperature, depending on the metal alloy of the electrode, in excess of700° F. (371° C.) for a period of time sufficient to thermally degradesurface impurities. In another embodiment, the electrosurgical devicemay be cleaned in a batch or bulk cleaning method, thereby cleaning allof the surfaces of the electrosurgical device.

In one embodiment, the epoxy modified rigid silicone powder hasself-adhesive properties. In this embodiment, when applied to thesurfaces of the electrosurgical device, the epoxy modified rigidsilicone powder particles will adhere. Thus, in this embodiment, nobonding layer is necessary to be applied to the electrode.

In another embodiment, the epoxy modified rigid silicone powderparticles must be affixed to one or more surfaces of the electrosurgicaldevice using one or more wet bonding materials. In this embodiment,after the surface of the electrosurgical electrode is cleaned, a layerof a wet bonding material such as a primer is applied to one or moresurfaces of the electrosurgical device. The layer of wet bondingmaterial is preferably applied uniformly so as to avoid forming a thicklayer, which is thicker than what is necessary or required, and avoiddrippings which may detract from the bonding ability to theelectrosurgical device.

In one embodiment, the bonding material layer may be formulated toimprove the bonding capabilities of the subsequent epoxy modified rigidsilicone powder coating layer or layers applied to the surface of theelectrosurgical electrode. In this embodiment, the wet bonding materialmay include one or more additives which change or enhance one or morecharacteristics of the wet bonding material. For example, in oneembodiment, the wet bonding material includes an ultraviolet light cureresin to semi or fully cure the bonding layer. In another embodiment,the wet bonding material includes an electron beam cure resin. It shouldalso be appreciated that the bonding material may be any suitablebonding material or agent. For example, a thin layer of any suitableepoxy may be utilized as the bonding layer to coat the surface of theelectrode prior to the application of the epoxy modified rigid siliconepowder.

In one embodiment, while the bonding material layer is still wet, asingle layer of epoxy modified rigid silicone powder is sprayed over thewet bonding material. In one embodiment, a substantially uniform layerof epoxy modified rigid silicone powder is applied to the wet bondingmaterial. The epoxy modified rigid silicone powder particles adhere tothe wet surface area of the bonding material in an even manner. In thisembodiment, when the wet bonding material is completely coated with onelayer of the uniform epoxy modified rigid silicone powder mixture ofparticles, additional epoxy modified rigid silicone powder particlescannot stick to the bonding material layer because the insulativequalities of the adhered epoxy modified rigid silicone powder particlesattached to the bonding material layer act as a barrier to otherparticles attaching to the wet bonding material layer. Therefore, theepoxy modified rigid silicone powder particles do not build up or forman uneven surface area on the surface of the electrosurgical electrode.Additionally, the wet bonding material layer may be a thick layer wherethe uniform epoxy modified rigid silicone powder particles sink into andare completely covered by the wet bonding material layer. In anotherembodiment, the wet bonding material layer is a substantially thin layeron the surface of the electrosurgical device and a substantial portionof the epoxy modified rigid silicone powder particles are exposed on thewet bonding material layer.

In another embodiment, an electrostatic, tribo-charged or oppositeelectrostatic charged powder spray method is used to apply the epoxymodified rigid silicone powder particles to either a dry electrosurgicaldevice or an electrostatic device coated with the wet bonding adhesionpromoting material. In one embodiment, the wet bonding agent is from theepoxy resin family. The electrostatically charged particle powder sprayenables an operator to better control the application uniformity of theepoxy modified rigid silicone powder particles and thereby enhance theuniformity, density and application of the epoxy modified rigid siliconepowder particles to the wet bonding material on the electrosurgicaldevice. It should be appreciated that the epoxy modified rigid siliconepowder particles may have one or more surface characteristics altered toallow for more efficient electrostatic, tribo-charged or oppositeelectrostatic charged powder spray techniques to be used to apply theepoxy modified rigid silicone powder particles to an electrosurgicaldevice.

Moreover, the above-described “tribo-charge” application techniquealters the edge coverage thickness of the applied powder based on anydesign requirements which require a more uniformly applied epoxymodified silicone nonstick powder to all surfaces of the device, whetherthe configuration has sharp or round edges. This technique results inoptimizing the different edge coverage thicknesses of the applied epoxymodified rigid silicone powder, whether the electrosurgical device is ablade, ball, wire or a different shape.

It should be appreciated that an electrosurgical device manufacturedwith an epoxy modified rigid silicone powder coating exhibits improveduniformity of coating thickness and coverage of the critical edge or tipcharacteristics. In one embodiment, due at least in part to the“Farraday” effect of applying increased amounts of coatings to a sharpcorner or edge, electrostatically applied epoxy modified rigid siliconepowder particles are more easily applied to and attach to the thin orsharp edges of the electrosurgical device. In this embodiment, byaltering the electrostatic powder coating equipment or techniques ofapplication, such as by changing the power settings, waveforms and/orother electrical characteristics of the application equipment, the edgesof the electrosurgical device are selectively more or less heavilycoated with the epoxy modified rigid silicone powder.

After the epoxy modified rigid silicone powder coatings are applied tothe surfaces of the electrode, the coatings are cured in a suitabledevice, such as an oven or furnace, or by using a suitable curing methodor process. The curing process hardens the coatings and promotes theadherence of the coatings to the electrode. The coated electrode,therefore, minimizes the build up of eschar on the surfaces of thecoated electrosurgical device.

In one embodiment, in addition to the epoxy modified rigid siliconepowder particles, a plurality of anti-microbial particles such assilver, silver ceramic, silver oxide or silver compounds or any suitablyanti-microbial agent are applied to one or more of the surfaces of theelectrosurgical device to reduce and kill bacteria and other potentialgerms that may be located on the surface(s) of the electrosurgicaldevice. In one aspect of this embodiment, the anti-microbial particlesare interspersed with the epoxy modified rigid silicone powder particlesand a layer of anti-microbial material is applied to the electrosurgicaldevice along with the epoxy modified rigid silicone powder particles.The above process can be repeated as necessary to maintain theeffectiveness of the anti-microbial surface. The addition of theanti-microbial material tends to kill bacteria or other harmfulorganisms that contact the surface of the electrode during and after thesurgical procedure. This coated electrode may be used multiple times indifferent surgical procedures without requiring sterilization (eventhough sterilization is preferred) because the anti-microbial particlesare capable of killing the bacteria and other harmful organisms whichcontact the surfaces of the electrode. The coated electrosurgical devicetherefore minimizes or reduces the chance of infections or othercomplications in the body after the surgical procedure is complete.

It is therefore an advantage of the present apparatus and method toprovide an epoxy modified rigid silicone powder coating to the surfaceof an electrosurgical device to prevent the build up of tissue on thedevice.

A further advantage of the present apparatus and method is to provide anepoxy modified rigid silicone powder coating to the surface of anelectrosurgical device to enable the device to be used multiple times indifferent surgical procedures.

Another advantage of the present apparatus and method is to provide anelectrosurgical device that is coated with a epoxy modified rigidsilicone powder to enable the device to be heated to temperatures atwhich other non-stick coatings break down and lose their non-stickproperties, wherein in the process of decomposing, such other non-stickcoatings generate toxic and noxious gasses and harmful airborneparticles.

Another advantage of the present apparatus and method is to provide anelectrosurgical device coated with a powder coating which includes asilicone resin and siloxane additive without any fluoropolymers.

Additional features and advantages of the present apparatus and methodare described in and will be apparent from, the following DetailedDescription and the Figures.

BRIEF DESCRIPTION OF THE FIGURES

The patent or application file contains at least one drawing executed incolor. Copies of this patent or patent application publication withcolor drawing(s) will be provided by the U.S. Patent and TrademarkOffice upon request and payment of the necessary fee.

FIG. 1 is a front perspective view of one embodiment of a coatedelectrosurgical instrument.

FIG. 2 is a cross-section view of the embodiment of FIG. 1 takengenerally along the line 2A-2A.

FIG. 2B is a cross-section view of the embodiment of FIG. 1 takengenerally along the line 2B-2B.

FIG. 3A is a cross-section view of another embodiment of theelectrosurgical instrument of FIG. 1 taken generally along the line3A-3A where a primer or base coating is applied to the surfaces of theinstrument.

FIG. 3B is a cross-section view illustrating the embodiment of FIG. 3A,including a layer of epoxy modified rigid silicone powder particles.

FIG. 3C is a cross-section view of FIG. 3B, including a top coatingapplied to the layer of epoxy modified rigid silicone powder particles.

FIG. 3D is a cross-section view of the embodiment of FIG. 3C takengenerally along the line 3D-3D.

FIGS. 4A and 4B are color photographs illustrating stages of degradationof an electrosurgical device coated with polytetrafluoroethylenecompared to an electrosurgical device coated with an epoxy modifiedrigid silicone powder.

DETAILED DESCRIPTION

Referring now to FIG. 1, one embodiment is illustrated where a coatingof epoxy modified rigid silicone powder is applied to an electrosurgicaldevice such as an electrosurgical instrument, blade or knife 100. Inthis embodiment, the coated electrosurgical instrument 100 includes anelectrode 102 and a holding device such as handle 104 or other suitableholding device which is connected to the electrode 102 and enables theelectrode to be manipulated in a surgical procedure. The electrodeincludes a conductive substrate or conductive material which enables theelectrode to conduct electrical energy or electricity. In oneembodiment, a portion of the electrode 102 is coated, encapsulated orover-molded with an electrically insulative material 103 such as asuitable plastic. The coated electrode 102 includes a distal end orworking end 106 and a proximal end or connection end 107 which may bebare metal and is not coated with any coating material. The exposeddistal end 106 of the electrode is used to cut, coagulate and/orcauterize tissue in a body during a surgical procedure. Specifically,electrical energy such as electricity is transferred from a suitableelectrical source through suitable wiring 109 to electrical conductors(not shown) inside the handle 104. The electrical energy is thentransferred from the conductors (not shown) in the handle 104 to theproximal end 107 of the electrode 102, which is electrically connectedto the conductors in the handle, and energizes the electrode 102. Onceenergized, the electrical and thermal energy produced by theelectrically charged electrode generates an elevated temperature whichenables the distal end 106 of the electrode to cut, coagulate and/orcauterize tissue in a body.

In one embodiment, an epoxy modified rigid silicone powder coating isevenly applied to the entire surface of the electrode to minimize thebuildup of tissue or eschar on the working surface of the electrode. Theepoxy modified rigid silicone powder coating has high temperaturecapabilities (i.e., a melting temperature of approximately 900° F. (482°C.)) and non-stick properties such that the electrosurgical electrodemay be heated to temperatures above which other non-stick coatings maybreak down and emit harmful byproducts. Accordingly, the rigid siliconecoating minimizes the buildup of tissue or eschar on the surface of theelectrode by minimizing the adherence of the tissue on the surface ofthe electrode. Specifically, the epoxy modified rigid silicone powdercoating forms a non-stick surface which reduces or prevents eschar fromadhering to the surface coated with the epoxy modified rigid siliconepowder. This enables a user such as a surgeon to continue a surgicalprocedure without having to continuously clean, scrape or brush offadhered charred tissue from the surface of the electrode.

In one embodiment, the epoxy modified rigid silicone powder coatingincludes a silicone resin and a polysiloxane additive. The siliconeresins may be selected from the group including a phenyl polysiloxanepowder resin, a methyl polysiloxane powder resin, a methyl phenylpolysiloxane powder resin, a phenyl alkyl polysiloxane powder resin, amethyl phenyl polysiloxane powder resin, a phenyl silicone powder and amethyl phenyl silicone. The siloxane additive includes a polysiloxaneadditive selected from the group consisting of a methyl alkylpolysiloxane, a dimethyl polysiloxane and a methyl phenyl siloxane. Itshould be appreciated that any suitable epoxy modified rigid siliconepowder with high temperature capabilities and non-stick properties maybe implemented.

In one embodiment, the polysiloxane additive is between about 0.5% toabout 10% parts per weight of the powder coating. In one embodiment, thesilicone resin is from about 5% to 75% parts per weight of the powdercoating. In another embodiment, the powder coating includes epoxy cresolnovolac. In this embodiment, the epoxy cresol novolac is from about 1%to about 50% parts per weight of the powder coating. In anotherembodiment, the powder coating includes o-cresol novolac. In thisembodiment, the o-cresol novolac is from about 1% to about 40% parts perweight of the powder coating. In another embodiment, the powder coatingincludes a solid bisphenol-A/epichlorohydrin epoxy resin. In thisembodiment, solid bisphenol-A/epichlorohydrin epoxy resin is from about1% to about 50% parts per weight of the powder coating.

As the properly formulated and/or reformulated epoxy modified rigidsilicone coating has an optimized or altered electrical conductivity,the epoxy modified rigid silicone powder particles applied to thesurface of the electrode more evenly distributes the temperature andelectrical energy transferred to the electrode while increasing theelectrical conductivity of the electrode. The increase and relativelyeven distribution of electrical energy or electricity to the electrodeenables the electrode to minimize “hot spots” or portions of theelectrode which have a higher temperature due a disproportionate ornon-uniform distribution of the electrical energy to the electrode. As aresult, a surgeon can make more precise cuts or coagulate or cauterizediscrete or specific parts of the tissue in the body with more accuracy.This improves the surgical procedure and also minimizes the time of thesurgical procedure. The amount of or density of the epoxy modified rigidsilicone powder particles or compounds included in the coating can beadjusted to increase or decrease the conductivity of the coating appliedto the surface of the electrode. In another embodiment, electricallyconductive pigments may be blended into the formulation to furtherenhance electrical energy transmission from the electrode thru the rigidsilicone coating.

In one embodiment, the size of the epoxy modified rigid silicone powderparticles may be changed as desired to accommodate different technicaland coating requirements or specifications. In one embodiment, the epoxymodified rigid silicone powder particles include at least one relativelylarge particle and at least one relatively small particle. In anotherembodiment, the epoxy modified rigid silicone powder particles range insize such as from a sub-micron to approximately 125-150 microns theepoxy modified rigid silicone particle layers are substantiallyspherical particles, which creates a softer, less abrasive surface onthe electrosurgical device.

In another embodiment, the uniform particle layer includes differentsized epoxy modified rigid silicone powder particles applied to thesurface of the electrosurgical device. In one example, hard abrasionresistant larger size particles and smaller electrically conductiveparticles are applied to create an abrasion resistant and electricallyconductive surface of the electrosurgical device. It should beappreciated that any suitably sized and shaped epoxy modified rigidsilicone powder particles may be applied to the surface of thesubstrate.

In one embodiment, prior to applying the epoxy modified rigid siliconepowder to one or more surfaces of the electrosurgical device, theelectrosurgical electrode is positioned on a support. Initially, thesurface of the electrosurgical electrode is cleaned with a cleaner toremove impurities which may be present on the surface of theelectrosurgical electrode. The cleaner such as a solvent may be manuallyapplied or mechanically applied to the electrosurgical electrode. In oneembodiment, grit blasting or sandblasting is used to clean the surfaceof the electrosurgical electrode. In one alternative embodiment, ratherthan grit blasting, an ultrasonic liquid cleaner is used to clean theelectrosurgical electrode. In this embodiment, the ultrasonic liquidcleaner strips a microscopic layer off the top surface of the electrode.In another embodiment, the electrosurgical electrode may be thermallycleaned by heating the electrode to a temperature, depending on themetal alloy of the electrode, in excess of 700° F. (371° C.) for aperiod of time sufficient to thermally degrade surface impurities. Inanother alternative embodiment, the electrosurgical electrode may bepre-cleaned or the method may be performed in a “clean room” where thecleaned part is manufactured and this cleaning step is not necessary. Inanother embodiment, the electrosurgical device may be cleaned in a batchor bulk cleaning method, thereby cleaning all of the surfaces of theelectrosurgical device.

In one embodiment, the epoxy modified silicone powder coating mixtureformulation has self-adhesive properties. In this embodiment, whenapplied to the surfaces of the electrosurgical device, the epoxymodified rigid silicone powder particles will adhere. Thus, in thisembodiment, no bonding layer is necessary to be applied to the electrodeafter the electrode is cleaned. In another embodiment, a silane couplingagent which is only a few molecules thick is used prior to theapplication of the epoxy modified rigid silicone powder. In thisembodiment, the silane coupling or adhesion promoting agent remains weton the electrode surface, the dry epoxy modified rigid silicone powderis applied directly to it and the electrode is cured once. One or moresuitable powder topcoats may then be applied to the cured electrode,with or without suitable liquid coupling or bonding agents.

In one embodiment, a very thin liquid epoxy-based material is applied tothe electrosurgical device after the electrode surface is cleaned butprior to the application of the epoxy modified rigid silicone powderparticles. In another embodiment, prior to the application of the epoxymodified rigid silicone powder particles, a very thin liquid epoxy-basedmaterial is applied to the cleaned electrode surface and the electrodesurface is semi-dried or semi-cured. These embodiments provide increasedadhesion of the epoxy modified rigid silicone powder particles to theelectrosurgical device by creating a linking or bonding agent betweenthe electrosurgical device and the subsequently applied epoxy modifiedrigid silicone powder particles.

In another embodiment, the epoxy modified rigid silicone powderparticles must be affixed to one or more surfaces of the electrosurgicaldevice using one or more bonding materials. In this embodiment, afterthe electrosurgical device is cleaned or is clean, a layer of asubstantially wet bonding material is applied to the electrosurgicaldevice. The bonding material provides a wet or moist surface for thesubsequent substantially uniform rigid silicone particle layer to adhereto. The wet bonding material may be any suitable bonding material, whichmeets the specific design specifications of the particularelectrosurgical device. In one embodiment, it is important that thebonding material remain wet prior to the application of the rigidsilicone particle layer so that the epoxy modified rigid silicone powderparticles stick to or adhere to the wet bonding material. In thisembodiment, a single layer of substantially uniform epoxy modified rigidsilicone powder particles are applied or powder sprayed onto the wetbonding material layer until the wet bonding material layer iscompletely coated with the dry uniform particles and a desired thicknessis achieved. The thickness of the coatings or coating layers isdependent on the specifications for the particular product, the amountof bonding material applied and the size and shape of the epoxy modifiedrigid silicone powder particles. It should be further appreciated thatthe epoxy modified rigid silicone powder particles may be applied to theelectrosurgical device utilizing any of the processes described inpublished U.S. patent application No. 2004/0116792 which is incorporatedherein by reference.

In one embodiment, the epoxy modified rigid silicone powder particlesare sprayed or applied onto the wet bonding material as a singlesubstantially uniform and substantially even layer which adheres to thesticky or wet surface of the bonding material. In another embodiment,the electrosurgical device is electrically grounded using a suitablegrounding method. Grounding the electrosurgical device thereby groundsthe wet bonding material layer, which is formulated to include solventsand/or liquids that conduct electrical energy. The substantially uniformepoxy modified rigid silicone powder particle layer has or will have anopposite electrical charge to that of the bonding material layer andtherefore is electrically or electrostatically attracted to the wetbonding material layer as the epoxy modified rigid silicone powderparticles are applied to that layer. In a further embodiment, anapplicator such as a sifter or electrostatic fluidized bed is used touniformly apply the epoxy modified rigid silicone powder particles tothe wet bonding material layer. The sifter is similar to a conventionalflour sifter or a drum sifter and is used in certain applicationsdepending on the required application of the uniform particles. Theelectrostatic fluidized bed contains a porous membrane made of porouspolyethylene or any suitable electrically non-conductive material whichallows the aeration of the powder with pressurized air that is chargedto approximately 60,000 volts with a metal grid under the porousmembrane, thereby charging the epoxy modified rigid silicone powderparticles. Charging the epoxy modified rigid silicone powder particlescause the particle to adhere to the grounded electrosurgical deviceplaced above or in the fluidized bed.

After the substantially uniform epoxy modified rigid silicone particlelayer is applied to the bonding material layer, the layer is cured tostrengthen the bond between the uniform rigid silicone particle layerand the wet primer layer on the surface of electrosurgical device. Thecuring process may be performed by heating the layers at a predeterminedtemperature or temperatures, air-drying the layers or by utilizing anysuitable internal or external curing process. When the substantiallyuniform epoxy modified rigid silicone powder particle layer hascompleted adhered or bonded to the bonding material layer, a suitablecoating layer may be applied to the uniform epoxy modified rigidsilicone powder particle layer. In this embodiment, the epoxy modifiedrigid silicone powder coating may be undercured in an oven or suitabledevice, thus creating a semi-cured layer to which subsequent liquid orepoxy modified rigid silicone powder layers may be attached with a finalcure which will consolidate the multiple layers. The coating may be anysuitable coating such as a topcoat or final coat material. Examplesinclude corrosive or abrasive resistant coatings, non-stick coatings orlow friction coatings, anti-microbial coatings and electricallyinsulative or conductive coatings or combinations thereof. It should beappreciated that areas of the electrosurgical device in which epoxymodified rigid silicone powder is not required can be vacuumed ormechanically wiped from the electrosurgical device prior to the ovencuring of the coating. This saves much production time and furtherreduces production costs.

In one embodiment, the metal electrosurgical blade or device is heatedto a temperature in excess of 500° F. (260° C.) using induction heatingor other suitable heating methods. A portion of the electrosurgicaldevice that is to be powder coated is immersed into a non-electrostaticfluidized bed up to the point where the coating is not required and heldthere for a period of time between one half second to approximately 10seconds. A layer of epoxy modified rigid silicone powder particles willadhere to the portion of the electrosurgical device that has beenimmersed into the fluidized bed of the powder. The electrosurgical bladeor device is then placed into a fixture or onto a conveyor device andpassed through a heating chamber to finish cure the layer of epoxymodified rigid silicone powder particles. It should be appreciated thatthis technique reduces the amount of masking or fixturing required forpowder spraying the same type of parts, particularly if the parts havecomplex shapes and/or blind cavities or recesses.

FIGS. 2A and 2B illustrate one embodiment of the electrosurgical blade100 of FIG. 1 wherein a single even layer of epoxy modified rigidsilicone powder particles 112 with self-adhesive properties is applieddirectly to the surface of the electrode 102 without the use of anybonding material layer. The electrode 102 includes major surfaces 108and minor surfaces 110. The rigid silicone particle coating is uniformlyand evenly applied to the major surfaces 108 and minor surfaces 110 ofthe electrode as shown in FIG. 2A. In this embodiment, the rigidsilicone coating enables the electricity to be evenly conducted anddisplaced across the surfaces of the electrode. This providessubstantial benefits in a surgical process by minimizing the buildup oftissue or eschar on the surface of the electrode thus reducing surgicaltime and possibly minimizing the likelihood of complications arisingduring surgery.

FIGS. 3A, 3B and 3C illustrate another embodiment of the electrosurgicalblade 100 of FIG. 1 wherein a single even layer of epoxy modified rigidsilicone powder particles 112 is applied to the surface of the electrode102 with the use of any suitable bonding material layer 114. In thisembodiment the major surfaces 108 and minor surfaces 110 of theelectrode are initially roughened to promote the adherence of thecoatings to the surfaces. After the surfaces are roughened or suitablycleaned, a wet bonding material such as a primer 114 is applied to themajor surfaces 108 and minor surfaces 110 of the electrode. The wetbonding material is applied evenly and uniformly to the surface of theelectrode. While the wet bonding material is still substantially wet, aplurality of epoxy modified rigid silicone powder particles 112 areapplied to the wet bonding material 114 as shown in FIG. 3B and asdisclosed above. The dry epoxy modified rigid silicone powder particlesengage, adhere to and are at least partially embedded in the wet bondingmaterial 114. The wet bonding material 114 therefore causes the epoxymodified rigid silicone powder particles 112 to adhere to and enhancethe adhesion of the epoxy modified rigid silicone powder particles tothe surface of the electrode 102.

In one embodiment, a top coating 116 is applied over the layer of epoxymodified rigid silicone powder particles 112 so that the top coatingcompletely and fully coats the layer of epoxy modified rigid siliconepowder particles on the surface of the electrode. This top coating maybe applied to a semi-cured epoxy modified rigid silicone powder prior tothe final bake. As shown in FIG. 3C, the top coating 116 is applied sothat the epoxy modified rigid silicone powder particles are exposed atthe surfaces of the electrode. Therefore, the electrosurgical electroderetains the benefits of minimizing the buildup of tissue or eschar onthe surface of the electrode. In this embodiment, the top coating is notapplied to the surfaces of the electrode covered by the insulative orplastic material 103 as shown in FIG. 3D. This fully exposes the maximumamount of epoxy modified rigid silicone powder particles underneath atleast a portion of the insulative material 103.

Referring now to FIGS. 4A and 4B, as described above, the hightemperature resistance of the epoxy modified rigid silicone powderenables the electrosurgical electrode to be heated to temperatures above500° F. (260° C.) which other non-stick coatings may break down, emitharmful byproducts and may micro-fracture during the decomposition. Forexample, FIGS. 4A to 4B illustrate the results of an experimentalcomparison between an electrosurgical device coated withpolytetrafluoroethylene (PTFE), sold under the trade name DuPont Teflon®851 204 (the left blade in FIGS. 4A and 4B) and an electrosurgicaldevice coated with an epoxy modified rigid silicone powder (the blackcolored right blade in FIGS. 4A and 4B) after the two blades are eachsubjected to a “power” setting of between 5.0 and 9.0 kv and a “Coag”setting between 70 and 150 for a period of between 10 and 30 secondsusing a ValleyLab generator, model Force 40S-20. It should beappreciated that the shown blades were not cleaned after a test cuttingthe same piece of calves liver (which is a common medical industrysubstitute for human flesh for electrosurgical testing). As seen inthese figures, while the black colored epoxy modified rigid siliconepowder coated blade substantially retains the epoxy modified rigidsilicone powder coating (as seen as the shiny black color in the colorphotographs submitted to the U.S. Patent and Trademark Office), the PTFEcoated blade exhibits substantial decomposition and discoloring of thegreen color PTFE, wherein the separate bands of discoloration of thegreen color on portion of the blade show the effect of elevatedtemperatures on the PTFE coated blade. Accordingly, unlike the PTFEcoated blade, except at the tip or edge of the blade, there issubstantially no deterioration or discoloration of the epoxy modifiedrigid silicone powder coating.

In one embodiment, in addition to the epoxy modified rigid siliconepowder particles, a plurality of anti-microbial particles such as silveror silver compounds are applied to one or more of the surfaces of theelectrosurgical device to reduce and kill bacteria and other potentialgerms that may be located on the surface(s) of the electrosurgicaldevice. In one aspect of this embodiment, the anti-microbial particlesare interspersed with the epoxy modified rigid silicone powder particlesand a layer of anti-microbial material is applied to the electrosurgicaldevice along with the epoxy modified rigid silicone powder particles.The above process can be repeated as necessary to maintain theeffectiveness of the anti-microbial surface. The addition of theanti-microbial material tends to kill bacteria or other harmfulorganisms that contact the surface of the electrode during and after thesurgical procedure. This coated electrode can be used multiple times indifferent surgical procedures without requiring sterilization (eventhough sterilization is preferred) because the anti-microbial particleskill the bacteria and other harmful organisms which contact the surfacesof the electrode. The coated electrosurgical device therefore minimizesthe chance of infections or other complications in the body after thesurgical procedure is complete.

In another embodiment, one or more additional epoxy modified rigidsilicone powder layers are applied to the first or primary epoxymodified rigid silicone powder layer applied to the surface of theelectrosurgical device to meet specific design specifications or coatingrequirements of a manufacturer. In this embodiment, the epoxy modifiedrigid silicone powder may be applied selectively to the electrosurgicaldevice. For example, the epoxy modified rigid silicone powder may beapplied to a long shank of a very long electrosurgical blade wherein theround shank is coated with two or more layers of the epoxy modifiedrigid silicone powder to create a thicker coating than a blade portionwhich is coated with one coat. In different embodiments, the additionalbonding material layers may be the same or different than the firstepoxy modified rigid silicone powder layer and are applied to the firstepoxy modified rigid silicone powder layer until a predeterminedthickness is achieved. Additionally, different materials may be added tothe bonding material layer or layers, based on specific designspecifications.

It should be understood that various changes and modifications to thepresently preferred embodiments described herein will be apparent tothose skilled in the art. Such changes and modifications can be madewithout departing from the spirit and scope of the present invention andwithout diminishing its intended advantages. It is therefore intendedthat such changes and modifications be covered by the appended claims.

1. An electrosurgical electrode connectible to a handle, saidelectrosurgical electrode comprising: a conductive substrate; a wetbonding material applied to a surface of the substrate; and at least oneepoxy modified rigid silicone powder coating applied to said wet bondingmaterial.
 2. The electrosurgical electrode of claim 1, wherein the epoxymodified rigid silicone powder coating includes a rigid silicone resinand a polysiloxane additive.
 3. The electrosurgical electrode of claim2, wherein the silicone resin is selected from the group consisting of:a phenyl polysiloxane powder resin, a methyl polysiloxane powder resin,a methyl phenyl siloxane powder resin, a phenyl silicone powder, amethyl phenyl silicone, a methyl phenyl polysiloxane powder resin and aphenyl alkyl polysiloxane powder resin.
 4. The electrosurgical electrodeof claim 2, wherein the polysiloxane additive is selected from the groupconsisting of: a methyl alkyl polysiloxane, a dimethyl polysiloxane anda methyl phenyl siloxane.
 5. The electrosurgical electrode of claim 1,wherein the epoxy modified rigid silicone powder coating includes arigid silicone resin.
 6. The electrosurgical electrode of claim 5,wherein the silicone resin is selected from the group consisting of: aphenyl polysiloxane powder resin, a methyl polysiloxane powder resin, amethyl phenyl siloxane powder resin, a phenyl silicone powder, a methylphenyl silicone, a methyl phenyl polysiloxane powder resin and a phenylalkyl polysiloxane powder resin.
 7. The electrosurgical electrode ofclaim 1, wherein the epoxy modified rigid silicone powder coatingincludes a polysiloxane additive.
 8. The electrosurgical electrode ofclaim 7, wherein the polysiloxane additive is selected from the groupconsisting of: a methyl alkyl polysiloxane, a dimethyl polysiloxane anda methyl phenyl siloxane.
 9. The electrosurgical electrode of claim 1,wherein the conductive substrate includes a metal.
 10. Theelectrosurgical electrode of claim 9, wherein the metal includesstainless steel.
 11. The electrosurgical electrode of claim 1, whichincludes an electrically insulative material applied to at least aportion of the surface of the conductive substrate.
 12. Theelectrosurgical electrode of claim 11, wherein a portion of theconductive substrate underneath the electrically insulative materialincludes the epoxy modified rigid silicone powder coating.
 13. Theelectrosurgical electrode of claim 1, wherein a plurality ofanti-microbial particles are interspersed in said powder coating. 14.The electrosurgical electrode of claim 13, wherein the anti-microbialparticles include at least one of the group consisting of: silverparticles and ceramic particles.
 15. The electrosurgical electrode ofclaim 1, which includes a single substantially uniform layer of theepoxy modified rigid silicone powder applied to the wet bondingmaterial.
 16. The electrosurgical electrode of claim 1, wherein the wetbonding material includes a primer.
 17. The electrosurgical electrode ofclaim 1, wherein the wet bonding material includes an ultraviolet lightcure resin.
 18. The electrosurgical electrode of claim 1, wherein thewet bonding material includes an electron beam cure resin.
 19. Theelectrosurgical electrode of claim 1, wherein the epoxy modified rigidsilicone powder coating includes at least one electrically conductivepigment.
 20. The electrosurgical electrode of claim 1, wherein thepowder coating includes a plurality of different sized epoxy modifiedrigid silicone powder particles.
 21. The electrosurgical electrode ofclaim 1, which includes a top coat selected from the group consistingof: an abrasive resistant coating, a non-stick coating, ananti-microbial coating and an electrically conductive coating.
 22. Theelectrosurgical electrode of claim 1, wherein at least part of theconductive substrate forms a shape selected from the group consistingof: a blade, a knife, a wire and a ball.
 23. An electrosurgicalelectrode connectible to a handle, said handle including at least oneelectrical transfer member configured to transfer electrical energy froman electrical source, said electrosurgical electrode comprising: aconductive substrate configured to receive said electrical energy; and awet bonding material applied to a surface of the substrate; at least onelayer of epoxy modified rigid silicone powder applied to the wet bondingmaterial.
 24. The electrosurgical electrode of claim 23, wherein theepoxy modified rigid silicone powder includes a rigid silicone resin anda polysiloxane additive.
 25. The electrosurgical electrode of claim 24,wherein the silicone resin is selected from the group consisting of: aphenyl polysiloxane powder resin, a methyl polysiloxane powder resin, amethyl phenyl siloxane powder resin, a phenyl silicone powder, a methylphenyl silicone, a methyl phenyl polysiloxane powder resin and a phenylalkyl polysiloxane powder resin.
 26. The electrosurgical electrode ofclaim 24, wherein the polysiloxane additive is selected from the groupconsisting of: a methyl alkyl polysiloxane, a dimethyl polysiloxane anda methyl phenyl siloxane.
 27. The electrosurgical electrode of claim 23,wherein the epoxy modified rigid silicone powder includes a rigidsilicone resin.
 28. The electrosurgical electrode of claim 27, whereinthe silicone resin is selected from the group consisting of: a phenylpolysiloxane powder resin, a methyl polysiloxane powder resin, a methylphenyl siloxane powder resin, a phenyl silicone powder, a methyl phenylsilicone, a methyl phenyl polysiloxane powder resin and a phenyl alkylpolysiloxane powder resin.
 29. The electrosurgical electrode of claim23, wherein the epoxy modified rigid silicone powder coating includes apolysiloxane additive.
 30. The electrosurgical electrode of claim 29,wherein the polysiloxane additive is selected from the group consistingof: a methyl alkyl polysiloxane, a dimethyl polysiloxane and a methylphenyl siloxane.
 31. The electrosurgical electrode of claim 23, whereinthe conductive substrate includes a metal.
 32. The electrosurgicalelectrode of claim 31, wherein the metal includes stainless steel. 33.The electrosurgical electrode of claim 23, wherein the epoxy modifiedrigid silicone powder includes a plurality of anti-microbial particles.34. The electrosurgical electrode of claim 33, wherein theanti-microbial particles include at least one of the group consistingof: silver particles and ceramic particles.
 35. The electrosurgicalelectrode of claim 33, which includes an electrically insulativematerial applied to at least a portion of the surface of the conductivesubstrate.
 36. The electrosurgical electrode of claim 33, wherein aportion of the conductive substrate underneath the electricallyinsulative material is coated with the epoxy modified rigid siliconepowder.
 37. The electrosurgical electrode of claim 23, wherein the wetbonding material includes a primer.
 38. The electrosurgical electrode ofclaim 23, which includes a single substantially uniform layer of theepoxy modified rigid silicone powder applied to the wet bondingmaterial.
 39. The electrosurgical electrode of claim 23, wherein the wetbonding material includes an ultraviolet light cure resin.
 40. Theelectrosurgical electrode of claim 23, wherein the wet bonding materialincludes an electron beam cure resin.
 41. The electrosurgical electrodeof claim 23, wherein the epoxy modified rigid silicone powder coatingincludes at least one electrically conductive pigment.
 42. Theelectrosurgical electrode of claim 23, wherein the powder coatingincludes a plurality of different sized epoxy modified rigid siliconepowder particles.
 43. The electrosurgical electrode of claim 23, whichincludes a top coat selected from the group consisting of: an abrasiveresistant coating, a non-stick coating, an anti-microbial coating and anelectrically conductive coating.
 44. The electrosurgical electrode ofclaim 23, wherein at least part of the conductive substrate forms ashape selected from the group consisting of: a blade, a knife, a wireand a ball.
 45. The electrosurgical electrode of claim 23, wherein saidconductive substrate includes a proximal end connectible to the handle.46. A method of coating an electrosurgical device including a conductivesubstrate, said method comprising the steps of: (a) applying a wetbonding material to at least a portion of a surface of the conductivesubstrate; (b) applying an epoxy modified rigid silicone powder coatingto the wet bonding material; and (c) at least partially curing the wetbonding material and the epoxy modified rigid silicone powder coating.47. The method of claim 46, wherein the wet bonding material includes aprimer.
 48. The method of claim 46, which includes the step of repeating(a) to (c) until a desired thickness is achieved.
 49. The method ofclaim 46, wherein the powder coating includes a plurality ofanti-microbial particles.
 50. The method of claim 49, wherein theanti-microbial particles include at least one of the group consistingof: silver particles and ceramic particles.
 51. The method of claim 46,which includes applying an electrically insulative material to at leasta portion of the surface of the conductive substrate.
 52. The method ofclaim 51, which includes applying the powder coating to a portion of thesurface of the conductive substrate underneath the insulative material.53. The method of claim 46, wherein the epoxy modified rigid siliconepowder coating includes a rigid silicone resin and a polysiloxaneadditive.
 54. The method of claim 53, wherein the silicone resin isselected from the group consisting of: a phenyl polysiloxane powderresin, a methyl polysiloxane powder resin, a methyl phenyl siloxanepowder resin, a phenyl silicone powder, a methyl phenyl silicone, amethyl phenyl polysiloxane powder resin and a phenyl alkyl polysiloxanepowder resin.
 55. The method of claim 53, wherein the polysiloxaneadditive is selected from the group consisting of: a methyl alkylpolysiloxane, a dimethyl polysiloxane and a methyl phenyl siloxane. 56.The method of claim 46, wherein the epoxy modified rigid silicone powdercoating includes a rigid silicone resin.
 57. The method of claim 56,wherein the silicone resin is selected from the group consisting of: aphenyl polysiloxane powder resin, a methyl polysiloxane powder resin, amethyl phenyl siloxane powder resin, a phenyl silicone powder, a methylphenyl silicone, a methyl phenyl polysiloxane powder resin and a phenylalkyl polysiloxane powder resin.
 58. The method of claim 46, wherein theepoxy modified rigid silicone powder coating includes a polysiloxaneadditive.
 59. The method of claim 58, wherein the polysiloxane additiveis selected from the group consisting of: a methyl alkyl polysiloxane, adimethyl polysiloxane and a methyl phenyl siloxane.
 60. The method ofclaim 46, wherein the wet bonding material includes an ultraviolet lightcure resin.
 61. The method of claim 46, wherein the wet bonding materialincludes an electron beam cure resin.
 62. The method of claim 46,wherein the epoxy modified rigid silicone powder coating includes atleast one electrically conductive pigment.
 63. The method of claim 46,wherein the powder coating includes a plurality of different sized epoxymodified rigid silicone powder particles.
 64. The method of claim 46,which includes applying a top coat to the epoxy modified rigid siliconepowder coating, said top coat selected from the group consisting of: anabrasive resistant coating, a non-stick coating, an anti-microbialcoating and an electrically conductive coating.
 65. The method of claim46, wherein said wet bonding material is electrically orelectrostatically charged and said epoxy modified rigid silicone powderhas an electrical or electrostatic charge opposite the electrical chargeof the wet bonding material.
 66. The method of claim 46, which includesevenly applying the epoxy modified rigid silicone powder coating to thewet bonding material.